lite-on technology corporation property of lite-on only features * high luminous intensity output. * low power consumption. * high efficiency. * versatile mounting on p.c. board or panel. * i.c. compatible/low current requirements. * popular t-1 3/4 diameter. package dimensions part no. lens source color LTL2R3KY yellow diffused alingap amber yellow notes: 1. all dimensions are in millimeters (inches). 2. tolerance is ? 0.25mm(.010") unless otherwise noted. 3. protruded resin under fl ange is 1.0mm(.04") max. 4. lead spacing is measured where the leads emerge from the package. 5. specifications are subject to change without notice. part no. : LTL2R3KY page : 1 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only absolute maximum ratings at t a =25 j parameter maximum rating unit power dissipation 75 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 60 ma dc forward current 30 ma derating linear from 50 j 0.4 ma/ j reverse voltage 5 v operating temperature range -40 j to + 100 j storage temperature range -55 j to + 100 j lead soldering temperature [1.6mm(.063") from body] 260 j for 5 seconds part no. : LTL2R3KY page : 2 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only electrical / optical characteristics at t a =25 j parameter symbol min. typ. max. unit test condition luminous intensity i v 140 380 mcd i f = 20ma note 1 viewing angle 2 c 1/2 50 deg note 2 (fig.5) peak emission wavelength f p 595 nm measurement @peak (fig.1) dominant wavelength f d 592 nm note 4 spectral line half-width gf 15 nm forward voltage v f 2.05 2.5 v i f = 20ma reverse current i r 100 g a v r = 5v capacitance c 40 pf v f = 0 , f = 1mhz note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye-response curve. 2. c 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag. 4. the dominant wavelength, f d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. part no. : LTL2R3KY page : 3 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only typical electrical / optical characteristics curves (25 j ambient temperature unless otherwise noted) part no. : LTL2R3KY page : 4 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only packing spec 1000, 500 or 250 pcs per packing bag 8 packing bags per inner carton total 8000 pcs per inner carton 8 inner cartons per outer carton total 64000 pcs per outer carton in every shipping lot, only the last pack will be non-full packing. part no. : LTL2R3KY page : 5 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only bin code list for reference luminous intensity unit : mcd @20ma bin code min. max. k 310 310 up j 240 310 h 180 240 g 140 180 note: tolerance of each bin limit is ? 15% dominant wavelength unit : nm @20ma bin code min. max. h20 595 600 h19 592 595 h18 590 592 h17 588 590 note: tolerance of each bin limit is ? 1nm part no. : LTL2R3KY page : 6 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment a nd household applications).consult liteon?s sales in advance for information on applications in which excep tional reliability is required, particularly when the failure or malfunction of the leds may directly jeopardiz e life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. storage the storage ambient for the leds should not ex ceed 30c temperature or 70% relative humidity. it is recommended that leds out of their origin al packaging are used within three months. for extended storage out of their original packag ing, it is recommended that the leds be stored in a sealed container with appropriate desi ccant or in desiccators with nitrogen ambient. 3. cleaning use alcohol-based cleaning solvents such as is opropyl alcohol to clean the leds if necessary. 4. lead forming & assembly during lead forming, the leads s hould be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch for ce possible to avoid excessi ve mechanical stress. 5. soldering when soldering, leave a minimum of 2mm clearan ce from the base of the lens to the soldering point. dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame dur ing soldering while the led is at high temperature. recommended soldering conditions : soldering iron wave soldering temperature soldering time 300c max. 3 sec. max. (one time only) pre-heat pre-heat time solder wave soldering time 100c max. 60 sec. max. 260c max. 10 sec. max. note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic failure of the led part no. : LTL2R3KY page : 7 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only 6. drive method an led is a current-operated device. in order to ensure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model a circuit model b led led (a) recommended circuit (b) the brightness of each led might appear differ ent due to the differences in the i-v characteristics of those leds 7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti- electrostatic glove when handling these leds ? all devices, equipment, and machinery must be properly grounded ? work tables, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing esd-damaged leeds will exhibit abnormal characteris tics such as high reverse leakage current, low forward voltage, or ?no light up? at low currents. to verify for esd damage, check for ?light up? and vf of the suspect leds at low currents. the vf of ?good? leds should be >2.0v@0.1ma fo r ingan product and >1.4v@0.1ma for alingap product. part no. : LTL2R3KY page : 8 of 10 bns-od-c131/a4 chip esd level machine model human body model ingan / sapphire 100 v 300 v alingap 200 v 500 v ingan / sic 600 v 1000 v
lite-on technology corporation property of lite-on only suggested checking list : training and certification 1. everyone working in a static-safe area is esd-certified? 2. training records kept and re-certification dates monitored? static-safe workstation & work areas 1. static-safe workstation or work-areas have esd signs? 2. all surfaces and objects at all static-safe wo rkstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd se nsitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive floorin g also present where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dsl? 5. all wrist strap or heel st rap checkers calibration up to date? note: *50v for blue led. device handling 1. every esds items identified by eia-471 labels on item or packaging? 2. all esds items completely inside properly clos ed static-shielding containe rs when not at static-safe workstation? 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 4. all flexible conductive and dissipative packag e materials inspected before reuse or recycle? others 1. audit result reported to entity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file? part no. : LTL2R3KY page : 9 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only 8. reliability test classification test item test condition reference standard operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs (-24hrs,+72hrs) mil-std-750d:1026 (1995) mil-std-883d:1005 (1991) jis c 7021:b-1 (1982) high temperature high humidity storage ta= 655 j rh= 90 ?? 95% test time= 240hrs2hrs mil-std-202f: 103b(1980) jis c 7021 : b-11(1982) high temperature high humidity reverse bias ta= 655 j rh= 90 ?? 95% vr=5v test time = 500hrs (-24hrs, +48hrs) jis c 7021 : b-11(1982) high temperature storage ta= 1055 j * test time= 1000hrs (-24hrs,+72hrs) mil-std-883d:1008 (1991) jis c 7021:b-10 (1982) endurance test low temperature storage ta= -555 j * test time=1000hrs (-24hrs,+72hrs) jis c 7021:b-12 (1982) temperature cycling 105 j ?? 25 j ?? -55 j ?? 25 j 30mins 5mins 30mins 5mins 10 cycles mil-std-202f:107d (1980) mil-std-750d:1051(1995) mil-std-883d:1010 (1991) jis c 7021: a-4(1982) thermal shock 105 5 j ?? -55 j 5 j 10mins 10mins 10 cycles mil-std-202f:107d(1980) mil-std-750d:1051(1995) mil-std-883d:1011 (1991) solder resistance t.sol = 260 5 j dwell time= 10 1secs mil-std-202f:210a(1980) mil-std-750d:2031(1995) jis c 7021: a-1(1982) environmental test solderability t. sol = 230 5 j dwell time= 5 1secs mil-std-202f:208d(1980) mil-std-750d:2026(1995) mil-std-883d:2003(1991) jis c 7021: a-2(1982) 9. others the appearance and specifications of the product may be modified for improvement, without prior notice. part no. : LTL2R3KY page : 10 of 10 bns-od-c131/a4
|
